Hi fatemehriazi1
In order to receive more numerous and robust responses you may need to rephrase your question with greater detail and specificity regarding your process objective. Please understand these materials are proprietary to their manufacturers and the probability that anyone will share trade secrets is very low.
From a review of articles, it would seem that all these materials have a metallized layer attached with adhesive to a variety of packaging substrates from rigid pasteboards to more flexible bag material depending on the goal to achieve. The predominant difference is not so much the metalized layer, but the configuration and materials of the substrate. The various goals include creating a hot spot with elevated temperatures to achieve faster, more complete popping of corn, toasting, crisping and browning. Another goal is that the packaging will serve to achieve the desired effect in either a conventional oven or a microwave oven. Sometimes the goal is to affect the food on multiple surfaces, giving rise to complex packaging configurations. Where the food actually contacts the packaging, there must be a protective layer to prevent migration of packaging chemicals into the food.
Recently, controversy has arisen because there is evidence that the elevated temperatures may cause PET, adhesives, heavy metals or other contaminates to migrate from packaging into the food. Evidence indicates foods high in fat are more easily contaminated with packaging ingredients when temperatures are elevated.
The specific goal for popcorn is different from the specific goal for a panini, therefore the configuration and materials of the packaging will be different.
Regards,
Greg
